High frequency PCB circuit boards Roger Fr4 RO4003c DK3.48 DF0.0031 Rogers pcb material

Item No.: Rogers RO4003c
Standard Thickness
*0.004(0.101mm)
0.0066”(0.168mm)
0.010"(0.254mm)
0.0133"(0.338mm)
0.0166*(0.422mm)
0.020"(0.508mm)
0.030”(0.762mm)
0.060"(1.524mm)
Description About Rogers Ro4003 Related parameters
Description
High frequency Roger PCB circuit boards
Special circuit board with higher electromagnetic frequency, generally speaking, high frequency can be defined as the frequency above 1GHz.  Its physical performance, accuracy, technical parameters are very high requirements, often used in automotive anti-collision systems, satellite systems, radio systems and other fields.
High-frequency circuit board refers to special circuit board with high electromagnetic frequency. It is used for PCB in the field of high frequency (frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meter). It is a circuit board produced by using part of the common rigid circuit board manufacturing process or special processing method on microwave base material copper-clad plate. In general, high-frequency boards can be defined as circuit boards with frequencies above 1GHz. 
About Rogers Ro4003
About Rogers RO4003

Offered in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles with all configurations meeting the same laminate electrical performance specification. RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required.

RO4003C materials are non-brominated and are not UL 94 V-0 rated. For applications or designs requiring a UL 94 V-0 flame rating, RO4835™ and RO4350B™ laminates do meet this requirement.

Features

· Dk of 3.38 +/- 0.05

· Dissipation factor of 0.0027 at 10 GHz

· Low Z-axis coefficient of thermal expansion at 46 ppm/°C

Benefits

· Ideal for multi-layer board (MLB) constructions

· Processes like FR-4 at lower fabrication cost

· Designed for performance sensitive, high volume applications

· Competitively priced

Related parameters
RO4003 Parameter Numerical value
Board materal RO4003c
Dielectric constant (εr) 3.55
Dielectric thikness 0.254 mm (0.010 in)
Copper cladding  
1 OZ
Copper cladding type double sided
Dissipation factor (tan δ)  
0.0027 0.0021
Board size (metric) 305 x 457 mm
Board size (inch)   
12 x 18 in
Service area Around the world 

Dickson Circuit Co.,Ltd has a 17 year history of producing high frequency PCB.
We cooperates with many well-known companies such as Samsung, Osram, Philips, and China Southern Power Grid.
The quality is guaranteed and the price is very affordable.

Just give me a Gerber file, and I will definitely give you a satisfactory product.

If you are interested, please feel free to contact me at any time.
Mikro

Email: Mikro@dicksoncircuit.com

Tel: +86 137 135 41332

WhatsApp:+86 137 135 41332

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